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Single-wafer wet processing equipment - List of Manufacturers, Suppliers, Companies and Products

Single-wafer wet processing equipment Product List

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Takeda Industrial's mass production sheet-type wet processing equipment 'TWP Series'

A production-type sheet resist strip and lift-off device for wafer surface treatment using a lift-off resist stripping process!

The mass production "TWP Series" is equipped with the following features: ■Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate a variety of small quantities and fluctuations in production volume - Enhanced quality and yield through sheet processing (Achieving precise processing without cross-contamination and improving uniformity and control within the surface) - Complete sheet processing in a single chamber - Paddle processing with a mechanism to prevent chemical solution from wrapping around the backside at low rotation speeds - Mechanism to prevent re-adhesion of liquid mist and peeling metal - Efficient jet peeling and mechanisms to prevent scattering of liquid mist and peeling metal - Efficient metal recovery mechanism *There is also a prototype "TWPm Series." https://www.ipros.jp/product/detail/2000745626 *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment
  • High pressure cleaner

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Takeda Industrial's experimental single-sheet wet processing device "TWPm Series"

A prototype sheet-type resist stripping and lift-off device for wafer surface treatment using the lift-off resist stripping process!

The prototype research device "TWPm Series" has the following features: ■ Features - Unique jet lift-off mechanism with high peeling performance - Improved flexibility and reduced running costs to accommodate small quantities of various types and fluctuations in production volume - Enhanced quality and yield through sheet processing (realization of precise processing without cross-contamination and improved uniformity and control within the plane) - Unique jet lift-off mechanism with high peeling performance - Achieved reduced footprint through compact size - Maintenance-free structure from the back - Functions inherited from conventional products - Dedicated device for one chamber * There is also a mass production "TWP Series." https://www.ipros.jp/product/detail/2000745622 * For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment
  • High pressure cleaner

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Various sheet-type wet processing equipment for FPD wet line LCD/PDP.

FPD Wet Line Various Sheet-Type Wet Processing Equipment for LCD/PDP

We contribute to enhancing our customers' added value by utilizing advanced fine processing technology for development and etching, as well as sophisticated thin plate transport technology.

  • Other semiconductor manufacturing equipment

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